In 2024
Géczy, A., Krammer, O., Tamus, Z. Á., & Csiszár, A. (2024, October). Low-Frequency Dielectric Tests of PLA/Flax Sustainable and Degradable PCB Substrates. In 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) (pp. 233-236). IEEE.
doi: 10.1109/SIITME63973.2024.10814873
Géczy, A., Gyenizse, L., Farkas, C., Rigler, D., Sáfár, B., & Csiszár, A. (2024, September). Biodegradable PCBs with PLA/Flax Substrate: FTIR and SEM Analysis of Soil Degradation. In 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (pp. 1-6). IEEE.
doi: 10.1109/ESTC60143.2024.10712063
Krammer, O., Hambuch, G., Bátorfi, R., Illés, B., & Géczy, A. (2024, October). Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates. In 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) (pp. 262-265). IEEE.
doi: 10.1109/SIITME63973.2024.10814765
Ruiz, D. J. C., Géczy, A., Grennerat, V., & Xavier, P. (2024, December). Tiny, Distributed, and Eco-Optimized: Proposal of Design Guidelines for Environmentally Friendly ML Devices. In 2024 IEEE/ACM Symposium on Edge Computing (SEC) (pp. 443-448). IEEE.
doi: 10.1109/SEC62691.2024.00050
Preliminary results
Farkas, C., Gál, L., Csiszár, A., Grennerat, V., Jeannin, P. O., Xavier, P., … & Géczy, A. (2024). Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and application tests. Sustainable Materials and Technologies, 40, e00902.
doi: https://doi.org/10.1016/j.susmat.2024.e00902
Géczy, A., Piffkó, D., Berényi, R., Dusek, K., Xavier, P., & Cuartielles, D. (2024). Implementation of microcontroller board on a sustainable and degradable PLA/flax composite substrate: a case study. Nanotechnology, 35(43), 435201.
doi: 10.1088/1361-6528/ad66d3
Farkas, C., Csiszár, A., Gál, L., Czaun, R., & Géczy, A. (2024, May). Soil Degradation of Sustainable PLA/Flax Substrates and Printed Circuit Board Assemblies. In 2024 47th International Spring Seminar on Electronics Technology (ISSE) (Vol. 2024, pp. 1-6). IEEE.
doi: 10.1109/ISSE61612.2024.10604191
(2024. nov 26-27) Eco-Design Approaches of Power Electronics (ECPE) – Hybrid Workshop –: Biodegradable Materials for Enhancing Circularity of Power Electronics PCBs (link) by Vincent Grennerat (GINP).
(2024. nov 11-15) Electronica 2024 in Munich (DE): Presentation of DESIRE4EU project by Antonello Pramaggiore (ALBA PCB Group). Publications and flyers (pas trouvé de lien ni mention du nom dans les speakers)
(2024. oct 16-19) IEEE SIITME conference in Sibiu (RO): Low-Frequency Dielectric Tests of PLA/Flax Sustainable and Degradable PCB Substrates by Attila Géczy (BME), Zoltán Tafferner (BME) (link). IEEE publication & flyers.
(2024. oct 16-19) IEEE SIITME conference in Sibiu (RO): Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates by Oliver Krammer, Gergely Hambuch, Réka Bátorfi, Balázs Illés, Attila Géczy (BME) (link). IEEE publication
(2024. oct 9) EU – INDIA – Joint Researchers Workshop on Semiconductors in Brussels (BE): Bio-based materials and processes for PCBs: an example of pathway for sustainable micro-nanoelectronics? (link) by Pascal Xavier (GINP).
(2024. sep 16-19) MNE24 conference in Montpellier (FR): Sustainable electronics. Could examples in RF, power electronics or printed circuit board be used for micro and nanoelectronics? (link) By Pascal Xavier (GINP).
(2024. Sept 10-14) IEEE ESTC conference in Berlin (DE): “Biodegradable PCBs with PLA/flax substrate: FTIR and SEM analysis of soil degradation” by Attila Géczy (BME) (link). Publication IEEE publication
All our target events
