PUBLICATIONS AND EVENTS 

Conference proceedings and papers

P Xavier, Attila Géczy, Gabor Molnar, Jean-Pierre Douchy, Karine Samuel, et al.. Inspired by nature: on the road to maximum circularity for consumer electronics boards. Electronique et Numérique Durables, Dec 2025, Grenoble, France. (hal-05466538)

Elia Laroche, Lorenzo Spadini, L Oxarango, Paula Morais, R Branco, et al.. Stratégies multiéchelles de recyclage de déchets riches en métaux: du réacteur de laboratoire au pilote de terrain. AFEM 2025 : 12ème colloque de l’Association Francophone d’Écologie Microbienne, Nov 2025, Beaune, France. (hal-05458646)

Ferial Guidoum, Vincent Grennerat, P Xavier, A Ciszar, P.-O Jeannin. RF Characterization of New Generations of Bio-Based PCB Substrates in Harsh Environment. European Microwave Conference, Sep 2025, Utrecht, Netherlands. (hal-05465515⟩)

Grennerat, V., Xavier, P., Jeannin, P. O., & Géczy, A. (2025, May). Power Electronics Solar Inverter on a Biosourced and Biodegradable Substrate–Thermal Study. In 2025 International Spring Seminar on Electronics Technology (ISSE) (pp. 1-6). IEEE. (mtak link)

Havellant, G., & Géczy, A. (2025, May). Enhancing the Manufacturability of Biodegradable PLA/Flax PCB Assemblies Through Design Optimization. In 2025 International Spring Seminar on Electronics Technology (ISSE) (pp. 1-6). IEEE. doi: 10.1109/ISSE65583.2025.11121033. (mtak link)

Tamus, Z. Á., Tosun, S. Z., & Géczy, A. (2025, May). Effect of Water Absorption on the Low-Frequency Dielectric Properties of Biodegradable PLA/Flax PCB Substrates. In 2025 International Spring Seminar on Electronics Technology (ISSE) (pp. 1-4). IEEE. doi: 10.1109/ISSE65583.2025.11121067. (mtak link)

Farkas, C., Gál, L., Gyenizse, L., Harsányi, G., Rigler, D., Sáfár, B., … & Géczy, A. (2025, May). Soil Degradation of Sustainable PCB Substrates in Natural and Controlled Environments. In 2025 International Spring Seminar on Electronics Technology (ISSE) (pp. 1-5). IEEE. doi: 10.1109/ISSE65583.2025.11121032

Tafferner, Z., & Géczy, A. (2025, May). A Brief Review on Electromigration Behaviours of Solder Joints Under Electrothermal Load. In 2025 International Spring Seminar on Electronics Technology (ISSE) (pp. 1-6). IEEE. doi: 10.1109/ISSE65583.2025.11120986 (mtak link)

Illés, B., Géczy, A., Tafferner, Z., Skwarek, A., & Krammer, O. (2025, May). Low-Temperature Soldering (LTS) in the Electronics Industry: A Brief Review. In 2025 International Spring Seminar on Electronics Technology (ISSE) (pp. 1-6). IEEE. doi: 10.1109/ISSE65583.2025.11120985 (mtak link)

Ádám, C., & Géczy, A. (2025, May). Current carrying capacity of PCB traces on PLA/Flax biodegradable substrates. In 2025 International Spring Seminar on Electronics Technology (ISSE) (pp. 1-5). IEEE. (mtak link)

Lebrun, Justine ; Toussaint, Sébastien ; Raskin, Jean-Pierre ; et. al. Assessing sustainability hotspots in the production of FR4 PCBs.imec Partner Week (Leuven, 03/04/2025) (Dial link)

Jean Martins, Elia Laroche, Lorenzo Spadini, Vincent Grennerat, Armelle Crouzet, et al.. Recovery of critical metals from electronic waste (WEEE) by applying a selected bacterial consortium as a nature-based solution.. DATE25 Congress, Mar 2025, Lyon, France. pp.17850 – 17856, ⟨10.1021/acsomega.0c01884⟩. (hal-05410816)

Ruiz, D. J. C., Géczy, A., Grennerat, V., & Xavier, P. (2024, December). Tiny, Distributed, and Eco-Optimized: Proposal of Design Guidelines for Environmentally Friendly ML Devices. In 2024 IEEE/ACM Symposium on Edge Computing (SEC) (pp. 443-448). IEEE. doi: 10.1109/SEC62691.2024.00050

Krammer, O., Hambuch, G., Bátorfi, R., Illés, B., & Géczy, A. (2024, October). Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates. In 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) (pp. 262-265). IEEE. doi: 10.1109/SIITME63973.2024.10814765

Géczy, A., Gyenizse, L., Farkas, C., Rigler, D., Sáfár, B., & Csiszár, A. (2024, September). Biodegradable PCBs with PLA/Flax Substrate: FTIR and SEM Analysis of Soil Degradation. In 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (pp. 1-6). doi: 10.1109/ESTC60143.2024.10712063

Géczy, A., Krammer, O., Tamus, Z. Á., & Csiszár, A. (2024, October). Low-Frequency Dielectric Tests of PLA/Flax Sustainable and Degradable PCB Substrates. In 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) (pp. 233-236). IEEE. DOI: 10.1109/SIITME63973.2024.10814873 (mtak link)

Booths

(2025 sep 15-18) The 25th European Microelectronics & Packaging Conference (EMPC 2025). Participation by ALBA, ABChimie, BME, GINP, SiNANO Institute

(2025. sep 11) TEK Days in Gdańsk (PL): Participation by ALBA.

(2024. nov 11-15) Electronica 2024 in Munich (DE): Presentation of DESIRE4EU project by Antonello Pramaggiore (ALBA PCB Group).

Presentations

(2025. may 14-18) IEEE ISSE in Budapest (HU): Presentations by BME, GINP, ALBA.

(2025. may 14-16) ADTC Conference in Grenoble (FR): Participation by GINP.

(2025. may 4) Sustainable Seminar at BME VIK in Budapest (HU): Participation by BME.

(2025. apr 29) Lecture – Swinburne University of Technology (remote, AU): Participation by Arduino.

(2025. apr 10) Innoelectro in Budapest (HU): Participation by BME.

(2025. apr 4) WS on TinyML for Sustainable Development in Malawi: Participation by Arduino.

(2025. apr 3) IMEC Partner Week in Leuven (BE): Participation by UCL.

(2025. mar 31) Workshop Eco-Es – DATE  in Lyon (FR): Participation by GINP.

(2025. mar 24-26) JCMM in Saint-Étienne (FR): Participation by GINP.

(2025. mar 15) Hackaday Berlin in Berlin (DE): Participation by Arduino.

(2025. mar 11-13) Embedded World in Nuremberg (DE): Participation by ALBA.

(2025. mar 5) BME Future Planner Conference Series in Budapest (HU): Participation by BME.

(2025. feb 26) EDGEAI Conference 2025 in USA: Participation by Arduino.

(2025. feb 8) Congreso Nacional STEAM in Spain: Participation by Arduino.

(2025. feb 3) STEAMBRACE in Sweden: Participation by Arduino.

(2024. dec 12) Symposium sur l’électronique et le numérique durables in Grenoble (FR): Éco-conception du PCB : comment améliorer son cycle de vie grâce à des bio-matériaux et de nouvelles approches de conception de la carte électronique (link) by Vincent Grennerat (GINP).

(2024. nov 26-27) Eco-Design Approaches of Power Electronics (ECPE) – Hybrid Workshop –: Biodegradable Materials for Enhancing Circularity of Power Electronics PCBs (link) by Vincent Grennerat (GINP).

(2024. oct 9) EU – INDIA – Joint Researchers Workshop on Semiconductors in Brussels (BE): Bio-based materials and processes for PCBs: an example of pathway for sustainable micro-nanoelectronics? (link) by Pascal Xavier (GINP).

Schools

(2025 Aug 27) ReTronics Summer School in Krakow (PL): Participation by GINP and BME

(2025. jun 16) Sustain-E Summer School in Grenoble (FR): Participation by UCL and GINP.

Tutorials

(2024. Oct 01-02) ET4 CNRS technological school in Lyon (FR) by GINP.

(2024. sep 16-19) MNE24 conference in Montpellier (FR): Sustainable electronics. Could examples in RF, power electronics or printed circuit board be used for micro and nanoelectronics? (link) By Pascal Xavier (GINP).