Preliminary results
Farkas, C., Gál, L., Csiszár, A., Grennerat, V., Jeannin, P. O., Xavier, P., … & Géczy, A. (2024). Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and application tests. Sustainable Materials and Technologies, 40, e00902.
doi: https://doi.org/10.1016/j.susmat.2024.e00902
Géczy, A., Piffkó, D., Berényi, R., Dusek, K., Xavier, P., & Cuartielles, D. (2024). Implementation of microcontroller board on a sustainable and degradable PLA/flax composite substrate: a case study. Nanotechnology, 35(43), 435201.
doi: 10.1088/1361-6528/ad66d3
Farkas, C., Csiszár, A., Gál, L., Czaun, R., & Géczy, A. (2024, May). Soil Degradation of Sustainable PLA/Flax Substrates and Printed Circuit Board Assemblies. In 2024 47th International Spring Seminar on Electronics Technology (ISSE) (Vol. 2024, pp. 1-6). IEEE.
doi: 10.1109/ISSE61612.2024.10604191
Conference proceedings
(2025. May 14-18) Ádám Csapody, Attila Géczy, Current carrying capacity of PCB traces on PLA/Flax biodegradable substrates, IEEE 48th International Spring Seminar on Electronics Tecnolgy (ISSE)
(2025. May 14-18) Gergő Havellant, Attila Géczy, Enhancing the Manufacturability of Biodegradable PLA/Flax PCB Assemblies by Design, IEEE 48th International Spring Seminar on Electronics Tecnolgy (ISSE)
(2025. May 14-18) Zoltán Ádám Tamus, Sila Zeynep Tosun, Attila Géczy, Effect of Water Absorption on the Low-Frequency Dielectric Properties of Biodegradable PLA/Flax Biodegradable PCB Substrates, IEEE 48th International Spring Seminar on Electronics Tecnolgy (ISSE)
(2025. May 14-18) Balázs Illés, Attila Géczy, Zoltán Tafferner, Agata Skwarek, Olivér Krammer, Low Temperature Soldering (LTS) in the Electronics Industry: a Brief Review, IEEE 48th International Spring Seminar on Electronics Tecnolgy (ISSE)
(2025. May 14-18) Csaba Farkas, László Gál, Lívia Gyenizse, Gábor Harsányi, Dániel Rigler, Balázs Sáfár, Dániel Gere, András Csiszár, Attila Gécz, Soil Degradation of Sustainable PCB Substrates in Natural and Controlled Environments, IEEE 48th International Spring Seminar on Electronics Tecnolgy (ISSE)
(2025. May 14-18) Zoltán Tafferner, Attila Géczy, A Brief Review on Electromigration Behaviours of Solder Joints Under Electrothermal Load, IEEE 48th International Spring Seminar on Electronics Technology (ISSE)
(2025. May 14-18) Balázs Illés, Attila Géczy, Zoltán Tafferner, Agata Skwarek, Olivér Krammer, Low Temperature Soldering (LTS) in the Electronics Industry: a Brief Review, IEEE 48th International Spring Seminar on Electronics Tecnolgy (ISSE)
(2024, December 04-07) David J. Cuartielles Ruiz; Attila Géczy; Vincent Grennerat; Pascal Xavier, Tiny, Distributed, and Eco-Optimized: Proposal of Design Guidelines for Environmentally Friendly ML Devices, 2024 IEEE/ACM Symposium on Edge Computing (SEC), DOI: 10.1109/SEC62691.2024.00050
(2024. oct 16-19) IEEE SIITME conference in Sibiu (RO): Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates by Oliver Krammer, Gergely Hambuch, Réka Bátorfi, Balázs Illés, Attila Géczy (BME) (link). IEEE publication
(2024. Sept 10-14) IEEE ESTC conference in Berlin (DE): “Biodegradable PCBs with PLA/flax substrate: FTIR and SEM analysis of soil degradation” by Attila Géczy (BME) (link). Publication IEEE publication
Booths
(2025 sep 15-18) The 25th European Microelectronics & Packaging Conference (EMPC 2025). Participation by ALBA, ABChimie, BME, GINP, SiNANO Institute
(2025. sep 11) TEK Days in Gdańsk (PL): Participation by ALBA.
(2024. nov 11-15) Electronica 2024 in Munich (DE): Presentation of DESIRE4EU project by Antonello Pramaggiore (ALBA PCB Group).
Presentations
(2025. may 14-18) IEEE ISSE in Budapest (HU): Presentations by BME, GINP, ALBA.
(2025. may 14-16) ADTC Conference in Grenoble (FR): Participation by GINP.
(2025. may 4) Sustainable Seminar at BME VIK in Budapest (HU): Participation by BME.
(2025. apr 29) Lecture – Swinburne University of Technology (remote, AU): Participation by Arduino.
(2025. apr 10) Innoelectro in Budapest (HU): Participation by BME.
(2025. apr 4) WS on TinyML for Sustainable Development in Malawi: Participation by Arduino.
(2025. apr 3) IMEC Partner Week in Leuven (BE): Participation by UCL.
(2025. mar 31) Workshop Eco-Es – DATE in Lyon (FR): Participation by GINP.
(2025. mar 24-26) JCMM in Saint-Étienne (FR): Participation by GINP.
(2025. mar 15) Hackaday Berlin in Berlin (DE): Participation by Arduino.
(2025. mar 11-13) Embedded World in Nuremberg (DE): Participation by ALBA.
(2025. mar 5) BME Future Planner Conference Series in Budapest (HU): Participation by BME.
(2025. feb 26) EDGEAI Conference 2025 in USA: Participation by Arduino.
(2025. feb 8) Congreso Nacional STEAM in Spain: Participation by Arduino.
(2025. feb 3) STEAMBRACE in Sweden: Participation by Arduino.
(2024. dec 12) Symposium sur l’électronique et le numérique durables in Grenoble (FR): Éco-conception du PCB : comment améliorer son cycle de vie grâce à des bio-matériaux et de nouvelles approches de conception de la carte électronique (link) by Vincent Grennerat (GINP).
(2024. nov 26-27) Eco-Design Approaches of Power Electronics (ECPE) – Hybrid Workshop –: Biodegradable Materials for Enhancing Circularity of Power Electronics PCBs (link) by Vincent Grennerat (GINP).
(2024. oct 9) EU – INDIA – Joint Researchers Workshop on Semiconductors in Brussels (BE): Bio-based materials and processes for PCBs: an example of pathway for sustainable micro-nanoelectronics? (link) by Pascal Xavier (GINP).
Schools
(2025 Aug 27) ReTronics Summer School in Krakow (PL): Participation by GINP and BME
(2025. jun 16) Sustain-E Summer School in Grenoble (FR): Participation by UCL and GINP.
Tutorials
(2024. Oct 01-02) ET4 CNRS technological school in Lyon (FR) by GINP.
(2024. sep 16-19) MNE24 conference in Montpellier (FR): Sustainable electronics. Could examples in RF, power electronics or printed circuit board be used for micro and nanoelectronics? (link) By Pascal Xavier (GINP).
